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CoolTherm® EP-6035 encapsulant is recommended as a thermally conductive, thin bondline adhesive for attaching semiconductors to heat sinks, and as a low viscosity potting product for use where thermal conductivity & non-burning properties are required.
CoolTherm® EP-6035 epoxy encapsulant is a two-component system recommended for use as a thermally conductive, thin bondline adhesive for attaching
semiconductors to heat sinks, and as a low viscosity potting and casting product for applications where thermal conductivity and non-burning properties are required.
Features and Benefits:
• Low Viscosity – maintains low viscosity for complete and void-free encapsulation.
• High Thermal Conductivity – provides high thermal conductivity for applications where superior heat transfer is required.
• Electrically Insulative – provides excellent high voltage insulation.
• Low Exotherm – exhibits low exotherm heat rise during room temperature cure.
• Broad Temperature Range – can be used on parts and devices that experience operating temperatures from -65°C to +155°C.
• UL Rated – provides excellent flame retardancy; UL 94 V-0 certified.
Shelf Life/Storage:
Shelf life of each component is one year when stored at 25°C in original, unopened container.
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