CoolTherm® EP-6035 Epoxy Encapsulant | Product Series

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CoolTherm® EP-6035 Epoxy Encapsulant

CoolTherm® EP-6035 Epoxy Encapsulant

CoolTherm® EP-6035 encapsulant is recommended as a thermally conductive, thin bondline adhesive for attaching semiconductors to heat sinks, and as a low viscosity potting product for use where thermal conductivity & non-burning properties are required.

Technical Specifications

  • Color: Black Liquid (resin), Tan Liquid (hardener), Black Liquid (mixed)
  • Dynamic Viscosity: 9500 cP @ 25°C (resin), 14000 cP @ 25°C (hardener), 12000 cP @ 25°C (mixed)
  • Number of Components: Two-Component (2K)
  • Hardness: 75 Shore D
  • Cure Time: 24 Hours @ 25°C, 2 Hours @ 65°C
  • Working Time: 2 Hours @ 25°C
  • Thermal Conductivity: 1 W/m-K
  • Dielectric Strength: 18.7 kV/mm, 475 V/mil
Safety Warning

Full Product Description

CoolTherm® EP-6035 epoxy encapsulant is a two-component system recommended for use as a thermally conductive, thin bondline adhesive for attaching
semiconductors to heat sinks, and as a low viscosity potting and casting product for applications where thermal conductivity and non-burning properties are required.

Features and Benefits:
• Low Viscosity – maintains low viscosity for complete and void-free encapsulation.
• High Thermal Conductivity – provides high thermal conductivity for applications where superior heat transfer is required.
• Electrically Insulative – provides excellent high voltage insulation.
• Low Exotherm – exhibits low exotherm heat rise during room temperature cure.
• Broad Temperature Range – can be used on parts and devices that experience operating temperatures from -65°C to +155°C.
• UL Rated – provides excellent flame retardancy; UL 94 V-0 certified.

Shelf Life/Storage:
Shelf life of each component is one year when stored at 25°C in original, unopened container.

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