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CoolTherm® EP-6035 encapsulant is recommended as a thermally conductive, thin bondline adhesive for attaching semiconductors to heat sinks, and as a low viscosity potting product for use where thermal conductivity & non-burning properties are required.
Compliance, Certifications & Safety |
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SDS-MSDS Safety Data Sheet: COOLTHERM EP-6035 BLACK RESIN |
SDS-MSDS Safety Data Sheet: COOLTHERM EP-6035 HARDENER |
Contact & Support Information |
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Request a Chomerics Product Sample |
Products |
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CoolTherm EP-6035 |