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Parker Chomerics CHO-BOND® 584-29 conductive adhesive is a two-component, silver-filled epoxy formulated for thin bond lines and where precise application is required
| Selector Guides |
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| Healthcare and Life Sciences Solutions - Medical Devices Manufacturing Products |
| Selector Guide: Parker Chomerics Specialty Materials |
| Product Demos & Tutorials |
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| Parker Chomerics Product Case Studies |
| Parker Chomerics Upcoming Webinars & On Demand Webinars |
| Recommended Surface Preparation for Epoxies, Acrylics and Silicones |
| Contact & Support Information |
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| Request a Chomerics Product Sample |
| Request a Chomerics Product Sample |
| Find Your Local Parker Chomerics Sales Rep or Distributor |
| Request a Quote |
| Literature and Reference Materials |
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| Datasheet: CHO-BOND 584-29 Syringe Kit |
| Datasheet: CHO-BOND® 584-29 |
| Parker Chomerics North America Terms and Conditions of Sale |
| Products | Packaging |
|---|---|
| 50-10-0584-0029 | 1 gram, 2 component, premeasured CHO-PAK |
| 50-02-0584-0029 | 2.5 gram, 2 component, premeasured CHO-PAK |
| 50-30-0584-0029 | 3 gram, 2 component, premeasured, syringe kits (10 total) |
| 50-03-0584-0029 | 10 gram, 2 component, premeasured CHO-PAK |
| 50-00-0584-0029 | 4 fluid ounce, 2 component, polypropylene kit |
| 50-01-0584-0029 | 8 fluid ounce, 2 component, polypropylene kit |
