CHO-BOND 584-29 TWO COMPONENT EASY TO USE CONDUCTIVE EPOXY ADHESIVE | #50-10-0584-0029


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50-10-0584-0029

CHO-BOND 584-29 TWO COMPONENT EASY TO USE CONDUCTIVE EPOXY ADHESIVE | #50-10-0584-0029

Parker Chomerics CHO-BOND® 584-29 conductive adhesive is a two-component, silver-filled epoxy formulated for thin bond lines and where precise application is required


Technical Specifications

  • Packaging: 1 gram, 2 component, premeasured CHO-PAK
  • Primer Included: Not Required
  • Weight: 1 g
  • Polymer Material Options: Epoxy
  • Filler Material: Silver
  • Ratio: 40:06.3
  • Color: Silver
  • Volume Resistivity: 0.002 Ω-cm
  • Lap Shear Strength: 8274 kPa
  • Specific Gravity: 2.5
  • Durometer: 80
  • Operating Temperature: -55 to 125 °C
  • Operating Time: 0.5 Hours
  • Shelf Life: 12 Months
  • Film Thickness: 0.03 mm
Safety Warning

Item Information

Parker Chomerics CHO-BOND® 584-29 conductive adhesive is a two-component, silver-filled epoxy formulated for thin bond lines and where precise application is required. CHO-BOND® 584-29 is a silver-colored epoxy designed to be used in very tight applications and around electrical components.

Features and Benefits:
• Silver filler is a premium conductivity solution to electrical bonding
• Excellent conductivity levels (0.002 ohm-com)
• Strong adhesion properties (>1200 PSI lap shear strength)
• Thin paste makes it effective for easy dispensing from a small needle for small cracks and voids
• Fast cure at elevated temperatures (15 minutes at 113°C) and room temperature cure options
• Low volatile organic compounds
• Comes in standard sizes of pre-measured syringes so no mixing and measuring is required

Typical Applications
• Electrical enclosure bonding
• Electrical component grounding
• Cold soldering
• Sealing and bonding machined enclosures

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