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Parker Chomerics CHO-BOND® 584-29 conductive adhesive is a two-component, silver-filled epoxy formulated for thin bond lines and where precise application is required
Parker Chomerics CHO-BOND® 584-29 conductive adhesive is a two-component, silver-filled epoxy formulated for thin bond lines and where precise application is required. CHO-BOND® 584-29 is a silver-colored epoxy designed to be used in very tight applications and around electrical components. Features and Benefits:• Silver filler is a premium conductivity solution to electrical bonding• Excellent conductivity levels (0.002 ohm-com)• Strong adhesion properties (>1200 PSI lap shear strength)• Thin paste makes it effective for easy dispensing from a small needle for small cracks and voids• Fast cure at elevated temperatures (15 minutes at 113°C) and room temperature cure options• Low volatile organic compounds• Comes in standard sizes of pre-measured syringes so no mixing and measuring is requiredTypical Applications• Electrical enclosure bonding• Electrical component grounding• Cold soldering• Sealing and bonding machined enclosures
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