Parker Chomerics THERM-A-FORM™ CIP35 is two component, dispensable thermal compound, with 3.5 W/m-K thermal conductivity, designed to cool electronics without excessive compressive force in sensitive cooling applications.

This versatile liquid can be hand or robotically dispensed and then cured into complex geometries for cooling of multi-height components on a printed circuit board (PCB) without the expense of a molded sheet.

CIP35 is available in ready-to-use cartridge systems, eliminating weighing, mixing, and degassing procedures.
This product has a thermal conductivity of 3.5 W/m-K and a hardness of 55 Shore A.

Features and Benefits:
• Dispensable form-in-place gap filling, potting, sealing, and encapsulating
• Excellent blend of high thermal conductivity, flexibility, and ease of use
• Conformable to irregular shapes without excessive force on components
• Ready-to-use cartridge system eliminates weighing, mixing, and de-gassing steps
• Variety of kit sizes and configurations available to suit any application (handheld twin-barrel cartridges, Semco® tubes, and pneumatic applicators)
• Vibration damping
• Long shelf life, no settling or degradation of cure
• Sag resistance. Maintains shape during cure

Typical Applications:• Automotive Electronic Control Units (ECUs)
• Power Supplies & Semiconductors
• Memory & Power Modules
• Microprocessors / Graphics
• Processors
• Flat Panel Displays & Consumer Electronics