Parker Chomerics THERM-A-GAP™ PAD 80LO is a high performance, low oil bleed, thermal gap filler pad with a typical thermal conductivity of 8.0 W/m-K. PAD 80LO was developed to be a high reliability and long-term solution for mission critical and high-performance electronics in nearly every market segment including advanced computing, defense electronics, telecommunications infrastructure, and automotive modules.

“LO” in the product name stands for “Low Oil”, indicating the very low silicone oil bleed and migration properties of this gap pad. PAD 80LO is meant to be used where the aesthetic or manufacturing issues of silicone oils can be a concern.

PAD 80LO has a hardness of 60 Shore 00 and exhibits excellent stress relaxation over time, with a nearly 90% reduction in compression force after just one hour. It is designed to impart minimal stress on components such as integrated circuits and provide physical protection such as vibration dampening while maintaining effective thermal contact where conformability in gaps or rough surface texture is a concern.

PAD 80LO can be provided in sheets or die cut to custom part sizes and is available in standard thicknesses as low as 0.040” to 0.200” (1.0 mm to 5 mm).

Product Features
• High thermal performance: 8.0 W/m-K conductivity
• Very low oil bleed and migration
• Very low compression force post-relaxation
• High tack surface reduces contact resistance
• Electrically isolating
• UL 94 V-0 flammability rating

Typical Applications
• High performance computing, GPUs, CPUs and memory modules
• 5G and Telecomm equipment
• Automotive sensors and devices
• Battery and energy storage modules
• Defense electronics