THERM-A-GAP PAD 70TP Thermally Conductive Gap Filler Pads | #62-05-1015-PAD70TPG


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62-05-1015-PAD70TPG

THERM-A-GAP PAD 70TP Thermally Conductive Gap Filler Pads | #62-05-1015-PAD70TPG

Parker Chomerics THERM-A-GAP™ PAD 70TP Thermally Conductive Gap Filler Pads provide a very low hardness (15 Shore 00) solution with 7.0 W/m-K of thermal conductivity.


Technical Specifications

  • Shape: Flat sheets
  • Size: 10 in x 15 in (254 mm x 381 mm)
  • Material Thickness: 0.05 in (1.27 mm)
  • Carrier Type: G - Fiberglass with PSA
  • Color: Dark Grey
  • Specific Gravity: 3.3
  • Deflection at Pressure: 38 % @ 50 psi (345 kPa)
  • Thermal Impedance: 0.27 °C-cm2/W
  • Heat Capacity: 0.72 J/g-K
  • Coefficient of Thermal Expansion: 150 ppm/K
  • Dielectric Strength: 127 VAC/mil, 8.0 kVAC/mm
  • Volume Resistivity: 10^13 ohm-cm
  • Operating Temperature: -67 to 392 °F, -55 to 200 °C
  • Dielectric Constant: 5.6 @ 1 MHZ
  • Dissipation Factor: 0.006 @ 1 MHZ
  • Outgassing Total Mass Loss: 0.05 % TML (0.01% CVCM)
  • Shelf Life: 24 Months
  • Flammability Rating: UL 94 V-0
  • Specifications Met: RoHS
  • Durometer: Softest
  • Product Type: Thermal Gap Pad
  • Thermal Conductivity: 7 W/m-K
  • Storage Temperature: 50 to 90 °F @ 50% RH, 10 to 32 °C @ 50% RH
Safety Warning

Item Information

Parker Chomerics THERM-A-GAP™ PAD 70TP is an ultra-soft, ultra-conformable high performance thermally conductive gap filler pad with 7.0 W/m-K thermal conductivity.

THERM-A-GAP PAD 70TP offers the combination of both excellent thermal conductivity and ultra-soft conformability, along with very low outgassing to provide an effective thermal interface between heat sinks and electronic devices where there are uneven surfaces, air gaps and rough surface textures may exist.

THERM-A-GAP PAD 70TP is manufactured to size and facilitates easy application on the desired component.
A fabric carrier version is available for improved tear resistance and easy handling. The product provides superior thermal performance and long term stability over conventional thermal pads.

Product Features and Benefits:
• High thermal conductivity 7.0 W/m-K
• Highly conformable, soft
• Low deflection force
• Electrically isolating
• Low oil bleeding

Typical Applications:
• Telecom Equipment
• PC board to chassis
• Thermally enhanced BGAs
• Memory packages & modules
• GPU & CPU
• Industrial Devices

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