THERM-A-FORM T642 Cure-in-Place Potting and Underfill Materials | #65-00-T642-0035


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65-00-T642-0035

THERM-A-FORM T642 Cure-in-Place Potting and Underfill Materials | #65-00-T642-0035

Parker Chomerics THERM-A-FORM™ T642 is a two-component, silicone elastomer with 1.20 W/m-k thermal conductivity and ideal for underfilling applications.


Technical Specifications

  • Package Type: 45cc Dual Element Cartridge
  • Color: Blue
  • Polymer Material Options: Silicone
  • Product Type: 2-part
  • Specific Gravity: 1.5
  • Durometer: 70 Shore A
  • Dynamic Viscosity: 2500 P
  • Operational Life: 60 min Pot Life
  • Maximum Cure Time (at Room Temperature): 3 min @ 150°C, 30 min @ 70°C, 48 Hours @ 23°C
  • Thermal Conductivity: 1.2 W/m-K
  • Heat Capacity: 1 J/g-K
  • Coefficient of Thermal Expansion: 300 ppm/K
  • Operating Temperature: -58 to 302 °F, -50 to 150 °C
  • Dielectric Strength: 200 kVAC/mm, 500 VAC/mil
  • Volume Resistivity: 10^13 (x1) ohm-cm
  • Dielectric Constant: 4 @ 1 MHZ
  • Dissipation Factor: 0.001 @ 1 MHZ
  • Flammability Rating: Not Tested
  • Outgassing Total Mass Loss: 0.32 % TML (0.21% CVCM)
  • Shelf Life: 3 Months
  • Weight: 53 g
  • Ratio: 10:1 Mix Ratio (by weight)
Safety Warning

Item Information

Parker Chomerics THERM-A-FORM™ T642 is a two-component, silicone elastomer with 1.20 W/m-k thermal conductivity and ideal for underfilling applications.

THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics cooling applications. These versatile liquid reactive materials can be dispensed and then cured into complex geometries for cooling of multi-height components on a PCB without the expense of a molded sheet. Each compound is available in ready-to-use cartridge systems, eliminating weighing, mixing, and degassing procedures.

Product Attributes:
• High thermal performance with flexibility
• Ideal for underfilling
• Low outgassing
• Boron Nitride filled material

Features and Benefits:
• Dispensable form-in-place gap filling, potting, sealing, and encapsulating
• Excellent blend of high thermal conductivity, flexibility, and ease of use
• Conformable to irregular shapes without excessive force on components
• Ready-to-use cartridge system eliminates weighing, mixing, and de-gassing steps
• Variety of kit sizes and configurations available to suit any application (handheld twin-barrel cartridges, Semco® tubes, and pneumatic applicators)
• Vibration damping

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