THERM-A-FORM CIP 30 U Thermally Conductive One Component Cure-In-Place Compound | #65-5P-CIP30U-10452


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65-5P-CIP30U-10452

THERM-A-FORM CIP 30 U Thermally Conductive One Component Cure-In-Place Compound | #65-5P-CIP30U-10452

Parker Chomerics THERM-A-FORM™ CIP 30 U is a single component, urethane, dispensable thermal compound with 3.0 W/m-K thermal conductivity.


Technical Specifications

  • Packaging: 5 Gallon Pail
  • Color: White
  • Flow Rate: 85 Gal/min
  • Specific Gravity: 3
  • Deflection at Pressure: n/a
  • Film Thickness: -
  • Thermal Conductivity: 3 W/m-K
  • Heat Capacity: -
  • Coefficient of Thermal Expansion: -
  • Operating Temperature: -22 to 176 °F
  • Dielectric Strength: 8.0 VAC/mil, 200 kVAC/mm
  • Volume Resistivity: 10^14 ohm-cm
  • Dielectric Constant: -
  • Dissipation Factor: -
  • Specifications Met: UL 94 V-0
  • Outgassing Total Mass Loss: -
  • Shelf Life: 12 Months
  • Part Type: 1k
Safety Warning

Item Information

Parker Chomerics THERM-A-FORM™ CIP 30 U is a single component, urethane, dispensable thermal compound with 3.0 W/m-K thermal conductivity.

THERM-A-FORM CIP 30 U offers excellent thermal performance while being priced economically, and is supplied and packaged as a one component, moisture cure material. When the material is dispensed and exposed to the environment, the low viscosity material cures to a consistency that is suitable for transferring heat from the battery pouches to the cooling plate with great reworkability.

THERM-A-FORM CIP 30 U is a high flow rate compound and will cure at room temperature and does not need to be accelerated with heat. Its non-silicone urethane binder will alleviate silicone contaminant concerns on the factory floor.

This material is available in a wide variety of containers and is designed to be dispensed through hand held dispensing systems or through large pail pump equipment for automated applications.

Features and Benefits:

• Reworkable: cures to a soft, gel-like consistency
• High flow nature is compatible with high volume applications
• Non-silicone
• Excellent blend of high thermal conductivity, flexibility, and ease of use
• Conformable to irregular shapes without excessive force on components
• One component, ready to use, no mixing required

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