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Parker Chomerics THERM-A-FORM™ CIP 30 U is a single component, urethane, dispensable thermal compound with 3.0 W/m-K thermal conductivity.
Parker Chomerics THERM-A-FORM™ CIP 30 U is a single component, urethane, dispensable thermal compound with 3.0 W/m-K thermal conductivity.
THERM-A-FORM CIP 30 U offers excellent thermal performance while being priced economically, and is supplied and packaged as a one component, moisture cure material. When the material is dispensed and exposed to the environment, the low viscosity material cures to a consistency that is suitable for transferring heat from the battery pouches to the cooling plate with great reworkability.
THERM-A-FORM CIP 30 U is a high flow rate compound and will cure at room temperature and does not need to be accelerated with heat. Its non-silicone urethane binder will alleviate silicone contaminant concerns on the factory floor.
This material is available in a wide variety of containers and is designed to be dispensed through hand held dispensing systems or through large pail pump equipment for automated applications.
Features and Benefits:
• Reworkable: cures to a soft, gel-like consistency
• High flow nature is compatible with high volume applications
• Non-silicone
• Excellent blend of high thermal conductivity, flexibility, and ease of use
• Conformable to irregular shapes without excessive force on components
• One component, ready to use, no mixing required
No CAD files available
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