THERM-A-FORM 1641 Cure-in-Place Potting and Underfill Materials | #65-00-1641-0000


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65-00-1641-0000

THERM-A-FORM 1641 Cure-in-Place Potting and Underfill Materials | #65-00-1641-0000

Parker Chomerics THERM-A-FORM™ 1641 is a one-component, RTV silicone elastomer with high operating temperature range and 0.9 W/m-k thermal conductivity.


Technical Specifications

  • Package Type: 2.5 fl. oz Foil squeeze tube
  • Color: White
  • Polymer Material Options: Silicone
  • Filler Material: Aluminum Oxide and Boron Nitride
  • Product Type: 1-part
  • Specific Gravity: 2.1
  • Durometer: 56 Shore A
  • Dynamic Viscosity: 3000 P
  • Operational Life: 30 min Pot Life
  • Maximum Cure Time (at Room Temperature): 48 Hours @ 23°C @ 50% RH
  • Thermal Conductivity: 0.9 W/m-K
  • Heat Capacity: 1 J/g-K
  • Coefficient of Thermal Expansion: 150 ppm/K
  • Operating Temperature: -94 to 392 °F, -70 to 200 °C
  • Dielectric Strength: 20 kVAC/mm, 500 VAC/mil
  • Volume Resistivity: 10^13 (x1) ohm-cm
  • Dielectric Constant: 3.9 @ 1 MHZ
  • Dissipation Factor: 0.010 @ 1 MHZ
  • Flammability Rating: Not Tested
  • Outgassing Total Mass Loss: Not Tested
  • Shelf Life: 6 Months
  • Weight: 70 g
Safety Warning

Item Information

Parker Chomerics THERM-A-FORM™ 1641 is a one-component, RTV silicone elastomer with high operating temperature range and 0.9 W/m-k thermal conductivity.

THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics cooling applications. These versatile liquid reactive materials can be dispensed and then cured into complex geometries for cooling of multi-height components on a PCB without the expense of a molded sheet. Each compound is available in ready-to-use cartridge systems, eliminating weighing, mixing, and degassing procedures.

Product Attributes:
• One-component moisture cure-cure RTV
• Supplied with primer 1086 (not required for curing but promotes adhesion)
• Non-acetic acid generating

Features and Benefits:
• Dispensable form-in-place gap filling, potting, sealing, and encapsulating
• Excellent blend of high thermal conductivity, flexibility, and ease of use
• Conformable to irregular shapes without excessive force on components
• Ready-to-use cartridge system eliminates weighing, mixing, and de-gassing steps
• Variety of kit sizes and configurations available to suit any application (handheld twin-barrel cartridges, Semco® tubes, and pneumatic applicators)
• Vibration damping

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