Thermoset® MD-130 Adhesive | Product Series

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Thermoset® MD-130 Adhesive

Thermoset® MD-130 Adhesive

Thermoset® MD-130 adhesive is a one-component, micro-electronic adhesive designed for a variety of semiconductor IC packaging applications where electrical conductivity is not required.

Technical Specifications

  • Color: Black Paste
  • Dynamic Viscosity: 60000 cP @ 77°F (25°C)
  • Specific Gravity: 1.49
  • Hardness: 88 Shore D
  • Volume Resistivity: 1 x 10^15 OHM-CM @ 77°F (25°C)
  • Thermal Conductivity: 0.42 W/m-K @ 248°F (120°C)
  • Cure Time: 8 to 24 min @ 302°F (150°C), 160 min @ 212°F (100°C)
Safety Warning

Full Product Description

Thermoset® MD-130 adhesive is a one-component, micro-electronic adhesive designed for a variety of semiconductor IC packaging applications where electrical conductivity is not required.


Features and Benefits:

• Fast Cure – quickly cures at temperatures down to 100°C, leaving no pits or voids for a smooth surface.

• Broad Temperature Range – can be used on parts and devices that experience operating temperatures from -55°C to +130°C.

• Excellent Stability – provides long room temperature stability and high shear strength.


Shelf Life/Storage:

Shelf life is six months when stored between 0°C and 5°C in original, unopened container. Syringe must be maintained in a vertical (upright) position with the dispense tip facing down. Do not store syringe on its side (horizontally).

Related Documents

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Products Trade Name
Thermoset MD-130 Thermoset MD-130 Adhesive

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