THERM-A-FORM 1642 Cure-in-Place Potting and Underfill Materials | Product Series

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THERM-A-FORM 1642 Cure-in-Place Potting and Underfill Materials

THERM-A-FORM 1642 Cure-in-Place Potting and Underfill Materials

Parker Chomerics THERM-A-FORM™ 1642 is a two-component, general duty, economical thermally conductive encapsulant/sealant/caulk with high shelf life (12 months) and low viscosity

Technical Specifications

  • Color: Blue
  • Polymer Material Options: Silicone
  • Filler Material: Aluminum Oxide
  • Product Type: 2-part
  • Specific Gravity: 2.3
  • Durometer: 76 Shore A
  • Dynamic Viscosity: 2500 P
  • Operational Life: 60 min Pot Life
  • Maximum Cure Time (at Room Temperature): 60 min @ 100°C, 4 Hours @ 65°C, 1 week @ 23°C
  • Thermal Conductivity: 0.95 W/m-K
  • Heat Capacity: 1 J/g-K
  • Coefficient of Thermal Expansion: 200 ppm/K
  • Operating Temperature: -94 to 392 °F, -70 to 200 °C
  • Dielectric Strength: 20 kVAC/mm, 500 VAC/mil
  • Volume Resistivity: 10^13 (x1) ohm-cm
  • Dielectric Constant: 3.9 @ 1 MHZ
  • Dissipation Factor: 0.010 @ 1 MHZ
  • Flammability Rating: Not Tested
  • Outgassing Total Mass Loss: 0.40 % TML (0.18% CVCM)
  • Shelf Life: 12 Months
  • Weight: 277 g (120 cc)
  • Ratio: 100:3 Mix Ratio (by weight)
  • Primer Included: CHO-BOND 1087
Safety Warning

Full Product Description

Parker Chomerics THERM-A-FORM™ 1642 is a two-component, general duty, economical thermally conductive encapsulant/sealant/caulk with high shelf life (12 months) and low viscosity.

THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics cooling applications. These versatile liquid reactive materials can be dispensed and then cured into complex geometries for cooling of multi-height components on a PCB without the expense of a molded sheet. Each compound is available in ready-to-use cartridge systems, eliminating weighing, mixing, and degassing procedures.

Product Attributes:
• General duty, economical thermal solution
• Two-component thermally conductive encapsulant/sealant/caulk/potting compound
• Supplied with primer 1087 (not required for cure but promotes adhesion)

Features and Benefits:
• Dispensable form-in-place gap filling, potting, sealing, and encapsulating
• Excellent blend of high thermal conductivity, flexibility, and ease of use
• Conformable to irregular shapes without excessive force on components
• Ready-to-use cartridge system eliminates weighing, mixing, and de-gassing steps
• Variety of kit sizes and configurations available to suit any application (handheld twin-barrel cartridges, Semco® tubes, and pneumatic applicators)
• Vibration damping

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