CoolTherm® ME-531 encapsulant is a high purity, semiconductor grade epoxy underfill product developed for the encapsulation of flip chip devices. It is formulated to reduce warpage and with the necessary structural strength to handle over-molding processes.

CoolTherm ME-531 encapsulant is engineered to withstand 260°C peak reflow temperatures of lead-free solders.

Features and Benefits:
• Self-Filleting – provides surface tension and viscosity flow properties to achieve full coverage without producing bulky fillet on top of device.
• Jettable – provides low viscosity for high speed jetting dispense.
• Rapid Flow – formulated to flow consistently without voids while maintaining a fast flow rate; can be used under small dies and under devices with stand-off heights above 25 micron.
• Low Coefficient of Thermal Expansion – minimizes the possibility of cracking during temperature cycling (-40°C to +125°C); provides excellent thermal shock performance.
• Good Adhesion – provides good adhesion to laminate, ceramic, solder mask and metal surfaces.
• Device Reliability – provides high Tg and high fracture toughness, reducing the amount of thermally induced stress placed on the solder interconnects.

Shelf Life/Storage:
Shelf life is six months when stored at -40°C in original, unopened container. Syringe must be maintained at -40°C in a vertical (upright) position with the dispense tip facing down. Do not store syringe on its side (horizontally).

This material is shipped and stored frozen. Consult handling instructions for thawing.