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Parker Chomerics CHO BOND® 1038 is a one component, silver-plated copper filled sealant formulated to serve as gap filler for EMI shielding or electrical grounding
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| Selector Guide: Parker Chomerics Specialty Materials |
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| Literature and Reference Materials |
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| Application Note: How to Apply CHO-BOND 1038 |
| Datasheet: CHO-BOND® 1038 and 1121 |
| Parker Chomerics North America Terms and Conditions of Sale |
| Products | Weight (g) | Primer Included | Packaging |
|---|---|---|---|
| 50-02-1038-0000 | 113.4 | 1086 | 1.5 fluid ounce aluminum foil tube |
| 50-02-1038-1000 | 113.4 | No | 1.5 fluid ounce aluminum foil tube |
| 50-33-1038-0000 | 227 | No | 2.5 fluid ounce SEMCO cartridge |
| 50-01-1038-0000 | 454 | 1086 | 6 fluid ounce SEMCO cartridge |
| 50-31-1038-0000 | 454 | No | 6 fluid ounce SEMCO cartridge |
