CHO-BOND 580-208 TWO COMPONENT ELECTRICALLY CONDUCTIVE EPOXY BUS BAR ADHESIVE | Product Series

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CHO-BOND 580-208 TWO COMPONENT ELECTRICALLY CONDUCTIVE EPOXY BUS BAR ADHESIVE

CHO-BOND 580-208 TWO COMPONENT ELECTRICALLY CONDUCTIVE EPOXY BUS BAR ADHESIVE

Parker Chomerics CHO-BOND® 580-208 conductive adhesive is a two-component, silver-filled epoxy is designed to be thinned and applied as an ink or spray coating

Technical Specifications

  • Polymer Material Options: Epoxy
  • Filler Material: Silver
  • Primer Included: Not Required
  • Ratio: 1:1 by weight
  • Color: Silver
  • Volume Resistivity: 0.003 Ω-cm
  • Lap Shear Strength: 4826 kPa
  • Specific Gravity: 2.9
  • Durometer: 80
  • Operating Temperature: -62 to 100 °C
  • Operating Time: 1.0 Hours
  • Shelf Life: 9 Months
  • Film Thickness: 0.03 mm
Safety Warning

Full Product Description

Parker Chomerics CHO-BOND® 580-208 conductive adhesive is a two-component, silver-filled epoxy is designed to be thinned and applied as an ink or spray coating. CHO-BOND® 580-208 is a silver-colored epoxy meant to be thinned and applied as a uniform coating with good bonding strength to a variety of substrates

Features and Benefits:
• Silver filler is a premium conductivity solution to electrical bonding
• Excellent conductivity levels (0.003 ohm-com)
• Strong adhesion properties (>700 PSI lap shear strength)
• Material can be sprayed or screen printed for bus bars
• Medium paste makes it effective for easy dispensing from a small needle for small cracks and voids
• Fast cure at elevated temperatures (45 minutes at 100°C) and room temperature cure options
• No volatile organic compounds
• 1:1 mix ratio makes measurement and application very easy

Typical Applications:
• Bus bars
• Grounding of EMI shielding windows

Related Documents

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Products Weight (g) Packaging
50-05-0580-0208 227 2 component, 8 fluid ounce polypropylene kit
50-01-0580-0208 454 2 component, 16 fluid ounce polypropylene kit

687PDC
179336