THERMATTACH T418 Double-Sided Thermal Tapes | #67-40-2400-T418


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67-40-2400-T418

THERMATTACH T418 Double-Sided Thermal Tapes | #67-40-2400-T418

Parker Chomerics THERMATTACH® T418 double-sided thermal interface tapes provide superior adhesion strength between electronic components and heat sinks as well as the best conformability to components.


Technical Specifications

  • Length (ft): 400
  • Width (inch): 24
  • Thermal Conductivity: 0.5 W/m-K
  • Configuration: Roll, Optional Boss
  • Color: Light Yellow
  • Carrier Type: Fiberglass
  • Material Thickness: 0.01 inch
  • Phase Transition Temperature: -20 °C
  • Operating Temperature: -30 to 125 °C
  • Thermal Impedance: 7.7 °C-cm2/W
  • Volume Resistivity: 10^13 ohm-cm
  • Lap Shear Strength: 1034 kPa
  • Specifications Met: UL 94 V-0, RoHS
  • Outgassing Total Mass Loss: Not Tested
  • Shelf Life: 12 Months
Safety Warning

Item Information

Parker Chomerics THERMATTACH® T418 double-sided thermal interface tapes provide superior adhesion strength between electronic components and heat sinks as well as the best conformability to components. The THERMATTACH® family of tapes are proven to offer excellent reliability when exposed to thermal, mechanical, and environmental conditioning. Thermal tapes increase design flexibility and decrease complexity of electronics assemblies by eliminating the need for mechanical fasteners.

Product Attributes:
• Superior adhesive strength
• Best conformability to components
• Good thermal performance

Features and Benefits:
• Offered in various forms to provide thermal dielectric and flame retardant properties
• Offered in custom die-cut configurations to suit variety of applications
• Embossed version available
• UL 94 V-0 flammability rated
• Meets RoHS specifications
• No curing required unlike epoxy or acrylic preforms or liquid systems
• Easily reworkable

Typical Applications:
• Mount heat sinks to components dissipating <25 W
• Attach heat sinks to PC processors
• Heat sink attachment to motor control processors
• Telecommunication infrastructure components

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