THERMATTACH T412 Double-Sided Thermal Tapes | #67-10-2400-T412


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67-10-2400-T412

THERMATTACH T412 Double-Sided Thermal Tapes | #67-10-2400-T412

Parker Chomerics THERMATTACH® T412 double-sided thermal interface tapes provide superior thermal conductivity and exceptional bonding properties between electronic components and heat sinks.


Technical Specifications

  • Length (ft): 100
  • Width (inch): 24
  • Thermal Conductivity: 1.4 W/m-K
  • Configuration: Roll, Embossed Standard
  • Color: Gray
  • Carrier Type: Aluminum Mesh
  • Material Thickness: 0.009 inch
  • Phase Transition Temperature: -30 °C
  • Operating Temperature: -30 to 125 °C
  • Thermal Impedance: 2 °C-cm2/W
  • Volume Resistivity: 10^2 ohm-cm
  • Lap Shear Strength: 480 kPa
  • Specifications Met: RoHS
  • Outgassing Total Mass Loss: 0.14 % TML (0.00% CVCM)
  • Shelf Life: 12 Months
Safety Warning

Item Information

Parker Chomerics THERMATTACH® T412 double-sided thermal interface tapes provide superior thermal conductivity and exceptional bonding properties between electronic components and heat sinks. The THERMATTACH® family of tapes are proven to offer excellent reliability when exposed to thermal, mechanical, and environmental conditioning. Thermal tapes increase design flexibility and decrease complexity of electronics assemblies by eliminating the need for mechanical fasteners.

Product Attributes:
• Good adhesion
• Superior thermal performance
• General use tape with added thermal conductivity of Al foil layer

Features and Benefits:
• Offered in various forms to provide thermal dielectric and flame retardant properties
• Offered in custom die-cut configurations to suit variety of applications
• Embossed version available
• UL 94 V-0 flammability rated
• Meets RoHS specifications
• No curing required unlike epoxy or acrylic preforms or liquid systems
• Easily reworkable

Typical Applications:
• Mount heat sinks to components dissipating <25 W
• Attach heat sinks to PC processors
• Heat sink attachment to motor control processors
• Telecommunication infrastructure components

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