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Parker Chomerics THERMATTACH® T411 double-sided thermal interface tapes provide exceptional bonding between electronic components and heat sinks, especially on plastic packages and low surface energy materials.
Parker Chomerics THERMATTACH® T411 double-sided thermal interface tapes provide exceptional bonding between electronic components and heat sinks, especially on plastic packages and low surface energy materials. The THERMATTACH® family of tapes are proven to offer excellent reliability when exposed to thermal, mechanical, and environmental conditioning. Thermal tapes increase design flexibility and decrease complexity of electronics assemblies by eliminating the need for mechanical fasteners. Product Attributes:• Designed for adhesion to plastic packages• Attaches to low surface energy packagesFeatures and Benefits:• Offered in various forms to provide thermal dielectric and flame retardant properties• Offered in custom die-cut configurations to suit variety of applications• Embossed version available• UL 94 V-0 flammability rated• Meets RoHS specifications• No curing required unlike epoxy or acrylic preforms or liquid systems• Easily reworkableTypical Applications:• Mount heat sinks to components dissipating <25 W• Attach heat sinks to PC processors• Heat sink attachment to motor control processors• Telecommunication infrastructure components
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