THERM-A-GAP GEL 75 Thermally Conductive Gel | #65-1P-GEL75-2500


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65-1P-GEL75-2500

THERM-A-GAP GEL 75 Thermally Conductive Gel | #65-1P-GEL75-2500

Parker Chomerics THERM-A-GAP™ GEL 75 fully cured dispensable gel has 7.5 W/m-K Thermal Conductivity as a one component fully cured system.


Technical Specifications

  • Package Type: 2500cc Pail (1 US Gal.)
  • Color: Light Gray, Pink
  • Flow Rate: 30 g/min, 24 g/min
  • Specific Gravity: 3.4, 2.85
  • Thermal Conductivity: 7.5 W/m-K, 2.4 W/m-K
  • Heat Capacity: 1 J/g-K, 1.257 J/g-K
  • Coefficient of Thermal Expansion: 150 ppm/K, <300 ppm/K
  • Operating Temperature: -67 to 392 °F, -67 to 392 °F, -55 to 200 °C
  • Dielectric Strength: 220 VAC/mil, 200 VAC/mil
  • Volume Resistivity: 10^14 ohm-cm, 10^12 ohm-cm
  • Dielectric Constant: 7.4 @ 1 MHZ, 7.4 @ 1 MHZ
  • Dissipation Factor: 0.003 @ 1 MHZ, 0.003 @ 1 MHZ
  • Flammability Rating: UL 94 V-0
  • Outgassing Total Mass Loss: 0.18 % TML (0.05% CVCM), 0.18 % TML (0.03% CVCM)
  • Shelf Life: 18 Months
  • Minimum Bondline Thickness: 0.008 inch, 0.004 inch, 0.20 mm, 0.10 mm
  • Polymer Material Options: Silicone
Safety Warning

Item Information

Parker Chomerics THERM-A-GAP GEL 75 is a high performance, one component, dispensable thermal interface material with 7.5 W/m-K thermal conductivity developed to conduct heat from electronics to a heat sink or enclosure.

The material’s heavy paste-like consistency enables controlled dispensing, applied in variable thicknesses to suit application needs. THERM-A-GAP GEL 75 requires low compressive force to deform under assembly pressure subjecting components, solder joints and leads to minimal stresses.

It is formulated to accommodate today’s high performance electronics and is ideal for automated dispensing machines, rework and field repair situations.

Features and Benefits:

• Thermal conductivity: 7.5 W/m-K
• Easily dispensed
• No secondary curing required
• Low thermal impedance
• Low compression force
• Reworkable

Typical Applications:

• Thermal heat dissipation for telecom base stations
• Power supplies and semiconductors
• Memory and power modules
• Microprocessors
•Central processing units (CPUs)

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