THERM-A-GAP GEL 50VT Thermally Conductive Gel | #65-02-GEL50VT-0180


LOADING IMAGES
65-02-GEL50VT-0180

THERM-A-GAP GEL 50VT Thermally Conductive Gel | #65-02-GEL50VT-0180

Parker Chomerics THERM-A-GAP™ GEL 50VT is a high performance, one-component, dispensable thermal interface gel material with 5.2 W/m-K thermal conductivity.


Technical Specifications

  • Package Type: 6oz (180cc) EFD plastic cartridge
  • Specifications Met: UL 94 V-0, RoHS
  • Color: White
  • Flow Rate: 20 g/min
  • Specific Gravity: 3.25
  • Thermal Conductivity: 5.2 W/m-K
  • Heat Capacity: 1 J/g-K
  • Coefficient of Thermal Expansion: 150 ppm/K
  • Operating Temperature: -40 to 302 °F, -55 to 200 °C
  • Dielectric Strength: 7.9 VAC/mil
  • Volume Resistivity: 10^14 ohm-cm
  • Dielectric Constant: 6.8 @ 100 KHZ
  • Dissipation Factor: 0.0002 @ 1 MHZ
  • Flammability Rating: UL 94 V-0
  • Outgassing Total Mass Loss: 0.135 % TML (0.0731% CVCM)
  • Shelf Life: 18 Months
  • Minimum Bondline Thickness: 0.006 inch, 0.15 mm
  • Polymer Material Options: Silicone
Safety Warning

Item Information

Parker Chomerics THERM-A-GAP™ GEL 50VT is a high performance, one-component, dispensable thermal interface gel material with 5.2 W/m-K thermal conductivity. It was developed to conduct heat from electronics to heat sinks or enclosures and perform reliably in vertical, high vibration, and harsh environments. During development, GEL 50VT was tested to a number of rigorous long term reliability tests such as automotive slump and high vibration testing and telecommunications thermal verification processes. GEL 50VT is meant to support mission critical applications that rely on consistent thermal performance over the course of hundreds or thousands of cycles and many years of continuous operation.

THERM-A-GAP™ GEL 50VT requires no mixing or curing and is designed for easy application and rework. It can be dispensed at various bond line thicknesses to take up gaps created by assembly or manufacturing tolerances. As with all Parker Chomerics thermal gels, it is formulated to accommodate today’s high-performance and high-reliability electronics while being ideal for automated dispensing machines and field repair situations.

Product Features
• Thermal conductivity: 5.2 W/m-k
• High vibration reliability
• Resistant to slump in vertical applications
• Low compression force
• No cure required
• One component
• Reworkable

Typical Applications
• Telecommunications infrastructure
• Automotive sensors and modules
• Consumer devices
• Energy storage applications
• Defense electronics
• Industrial equipment

Read More Show Less

CAD Drawings + Files

No CAD files available

Ok

x

Quantity:
Request a Quote

The item has been successfully added to your quote cart Go to Quote Cart

x

Ok

x

Find a Distributor

Where to Buy

Local Contact

Get your Parker account Today!

Create one account to manage everything you do with Parker, from your shopping preferences to your application access.

687PDC
179336