Parker Chomerics THERM-A-GAPTM GEL 50TBL is a reworkable, high performance, one component, dispensable thermal interface material with 5.0 W/m-K bulk thermal conductivity developed to conduct heat from electronics to a heat sink or enclosure at very thin bond lines. At minimum bond line thicknesses, the apparent thermal conductivity can exceed 10 W/m-K. The “TBL” suffix stands for Thin Bond Line, indicating that this material is meant for think bond line applications with gaps as small as 0.002” or 0.05mm. THERM-A-GAPTM GEL 50TBL requires no mixing or curing and is designed for easy application and rework.

THERM-A-GAPTM GEL 50TBL requires very low compressive force to deform under assembly pressure subjecting components, solder joints and leads to minimal stresses. This material is designed for thin bond lines and is not meant to be used as a gap filler for larger gaps in electronics assemblies.

As with all thermal gels, it is formulated to accommodate today’s high performance and high reliability electronics while being ideal for automated dispensing machines, rework and field repair situations.

Product Features
• Thermal Conductivity (bulk): 5.0 W/m-K
• Thermal Conductivity at minimum bond line thickness: >10 W/m-K
• Easily dispensed
• No secondary curing required
• No pump out
• Low thermal impedance
• Very low compression force
• Reworkable

Typical Applications
• Automotive electronic control units (ECUs)
• Telecommunications base stations
• Power suppliers and semiconductors
• Memory and power modules
• Flat panel displays and consumer electronics
• Microprocessors and graphics processors