Parker Chomerics THERM-A-GAP™ Gel 30 is a fully cured dispensable gel designed to eliminate time consuming hand assembly, decreasing installation costs and reducing customer manufacturing and purchasing (logistical) complexity. It requires no mixing or curing, providing superior design flexibility.



Features/Benefits:

• Easily dispensable

• Fully-cured / No pump out

• High bulk thermal conductivity

• Low thermal impedance

• Ultra low compression force

• High tack surface & reworkable

• Proven long-term reliability



Product Attributes:

• Provides low thermal impedance at thin and thick gaps, allowing use of common heat spreaders

• Proven reliability in extreme temperature cycling and shock & vibration

• Deflects easily under very low compressive forces, decreasing stress on components thus decreasing component failures.

• Accommodates a variety of bond line thicknesses for application to multiple devices

• Successfully used to fill a variety of different gap thickness

• Compatible with high volume, automated dispense processes

• Meets Telcordia (Bellcore) silicone specifications



Typical Applications:

• Automotive Electronic Control Units (ECU’s)

• Power Supplies & Semiconductors

• Memory & Power Modules

• Microprocessors / Graphics

• Processors

• Flat Panel Displays & Consumer Electronics