THERM-A-FORM CIP 60 Thermally Conductive Cure-In-Place Compound | #65-00-CIP60-0045


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65-00-CIP60-0045

THERM-A-FORM CIP 60 Thermally Conductive Cure-In-Place Compound | #65-00-CIP60-0045

Parker Chomerics THERM-A-FORM CIP 60 is a two-component (2k) dispensable thermal gap filler and cure-in-place material with 6.0 W/m-K thermal conductivity.


Technical Specifications

  • Package Type: 50cc 1:1 dual component cartridge
  • Polymer Material Options: Silicone Rubber (VMQ, PVMQ)
  • Filler Material: Aluminum Oxide and Boron Nitride
  • Specific Gravity: 3.2
  • Durometer: 50 Shore 00
  • Dynamic Viscosity: 5000 P
  • Thermal Conductivity: 6.0 W/m-K
  • Heat Capacity: 1 J/g-K
  • Operating Temperature: -58 to 392 °F, -50 to 200 °C
  • Dielectric Strength: 9.3 kVAC/mm, 250 VAC/mil
  • Volume Resistivity: 10^13 (x1) ohm-cm
  • Dielectric Constant: 8
  • Dissipation Factor: 0.006
  • Flammability Rating: UL 94 V-0
  • Outgassing Total Mass Loss: 0.05
  • Shelf Life: 6 Months
  • Maximum Cure Time (at Room Temperature): 60, 24
Safety Warning

Item Information

Parker Chomerics THERM-A-FORM CIP 60 is a two-component (2k) dispensable thermal gap filler and cure-in-place material with 6.0 W/m-K thermal conductivity. CIP 60 is designed to be an alternative to hard-curing dispensable materials but also an provide an improvement over standard application methods associated with thermal gap filler pads.

As a two-component dispensable material, it has an excellent flow rate and can be dispensed in high volumes or used to fill in applications that require heat transfer in challenging geometries.

With a 1:1 mix ratio and packaged in cartridges of various sizes, this material can be easily dispensed through a static mixing tip using either manual or automated dispensing equipment.

Product Features
- Two-part (2k) dispensable material
- Excellent thermal performance (6.0 W/m-K)
- Excellent flow rate for high speed dispensing
- Conformable to irregular shapes
- No pre-mixing or weighing of components required
- Vibration dampening

Typical Applications
- Automotive E-Mobility (converters, inverters)
- Automotive Infortainment (Display, HUD, Audio)
- Automotive ADAS (DCU, Camera, Radar/Lidar)
- SSD (Enterprise, Consumer)

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