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Parker Chomerics T660 Thermal Grease is a low viscosity grease with 0.9 W/m-k thermal conductivity and serves as an ideal solution for think bond line applications.
Parker Chomerics T660 Thermal Grease is a low viscosity grease with 0.9 W/m-k thermal conductivity and serves as an ideal solution for think bond line applications. T660 is a light gray material and contains solder fillers for extremely low thermal impedance at thinner bond lines (down to 0.001 in.). Parker Chomerics thermal greases offer a range of performance covering the simplest to the most demanding thermal requirements. These materials are screened, stenciled or dispensed and require virtually no compressive force to conform under typical assembly pressures. The excellent surface wetting results in low interfacial resistance. Features and Benefits:• Silicone based materials conduct heat between a hot component and a heat sink or enclosure• Fills interface variable tolerances in electronics assemblies and heat sink applications• Dispensable, highly conformable materials require no cure cycle, mixing or refrigeration• Thermally stable and require virtually no compressive force to deform under typical assembly pressures• Supports high power applications requiring material with minimum bond line thickness and high conductivity• Ideal for rework and field repair situations
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