Parker Chomerics T-Wing Thin Heat Spreaders provide a low cost, effective means of cooling high-density integrated circuit devices by conducting heat away from key components. T-Wing spreaders consist of 5oz. (0.007inch/0.18mm thick) flexible copper foil between electrically insulating films. High strength silicone PSA (pressure-sensitive adhesive) provides a strong bond to the heat-generating component. The compliant nature of these “thermal wing” heat spreaders permits nearly 100% adhesive contact with non-flat package surfaces, optimizing thermal and mechanical performance.

Product Attributes:
• Low profile design (0.013 In/0.33 mm) allows for use in limited space applications
• Easy peel and stick adhesion to all surfaces
• Low application force (<0.5 psi) minimizes risk to components
• Pliability for flexibility in conformance shapes
• Lightweight (0.039 oz./in²)

Features and Benefits:
• Component junction temperature reduction of 10-20°C
• Easily added to existing designs to lower component temperatures and improve reliability
• Custom shapes available for complex designs
• UL 94 V-0 flammability rated

Typical Applications:
• Microprocessors
• Memory modules
• Laptop PCs and other high density, handheld portable electronics
• High speed disk drives