CoolTherm® MD-140 SP (Small Particle) silver-filled conductive adhesive offers excellent thermal conductivity. It is designed for use in thermally demanding die attach applications such as microprocessor, power semiconductor and VLSI assembly. CoolTherm MD-140 SP adhesive is low stress, making it suitable for use with large die.

CoolTherm MD-140 SP adhesive provides excellent adhesion to a wide variety of surfaces including silicon, silver, gold and copper. Low ionic levels make it ideally suited for demanding semiconductor and hybrid assembly applications.

Features and Benefits:

• Convenient – provides a working life of up to 72 hours after loading a syringe into the dispensing equipment at room temperature.

• Excellent Dispensability – allows high-speed, accurate syringe dispensing of fine dots or lines; can be used with time/pressure, positive displacement or linear dispense heads.

• Fast Cure – rapidly cures at 150°C and 180°C.

Shelf Life/Storage:

Shelf life is six months when stored at -40°C in original, unopened container. Syringe must be maintained at -40°C in a vertical (upright) position with the dispense tip facing down. Do not store syringe on its side (horizontally).

This material is shipped and stored frozen. Consult handling instructions for thawing.