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Parker Chomerics CHO BOND® 1121 is a one component, VOC-free, silver-plated copper filled sealant formulated to serve as gap filler for EMI shielding or electrical grounding
Parker Chomerics CHO BOND® 1121 is a one component, VOC-free, silver-plated copper filled sealant formulated to serve as gap filler for EMI shielding or electrical grounding. CHO BOND® 1121 is a gray-colored silicone that is ideally used for filling gaps but can also serve as a repair or bonding agent for elastomer gaskets where moderate strength (150 PSI lap shear strength) is required. CHO-BOND® 1121 has identical properties to CHO BOND® 1038 with the exception of VOC content and shelf life (1121 has no VOCs and 12 month shelf life). Features and Benefits:• One-component system so no mixing or measuring required• Excellent electrical conductivity levels (0.010 ohm-cm)• No corrosive by-products generated during drying• Extended shelf life (12 months) relative to similar conductive sealants• Medium consistency paste makes the material easy to dispense in overhead or vertical applications• No Volatile Organic Compounds (VOC-free)• Working time of 30 minutes and can be handled in 24 hours• No pressure required when curing to achieve bondTypical Applications:• Man-portable electronics• Radar and Communication Systems• EMI vents• Military Ground Vehicles• Military Shelters
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