CoolTherm® EP-6037/6010 Epoxy System | Product Series

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CoolTherm® EP-6037/6010 Epoxy System

CoolTherm® EP-6037/6010 Epoxy System

CoolTherm® EP-6037/6010 epoxy system is a two-component epoxy system primarily used by the semiconductor industry to form thermally conductive joints in fabricated heat sinks and between heat sinks and power devices.

Technical Specifications

  • Color: Black or Green Paste (resin), Amber Liquid (hardener)
  • Dynamic Viscosity: 500000 cP @ 25°C (resin), 55 cP @ 25°C (hardener)
  • Specific Gravity: 2.35 (resin), 0.92 (hardener)
  • Cure Time: 24 Hours @ 25°C, 2 Hours @ 65°C
  • Hardness: 93 Shore D
  • Thermal Conductivity: 1.2 W/m-K
  • Lap Shear Strength: 10 MPa, 1450 psi
  • Dielectric Strength: > 15.7 kV/mm, > 400 V/mil
Safety Warning

Full Product Description

CoolTherm® EP-6037/6010 epoxy system is a two-component epoxy system primarily used by the semiconductor industry to form thermally conductive joints in fabricated heat sinks and between heat sinks and power devices. CoolTherm EP-6037/6010 epoxy system can also be used for bonding semiconductors and transistors to heat sinks, and for general purpose bonding of electronic components.

Features and Benefits:

• Low Stress – exhibits low shrinkage and stress on components as it cures.
• Excellent Adhesion – provides a strong adhesion bond to a wide variety of substrates.
• Low Coefficient of Thermal Expansion – minimizes the possibility of cracking during severe temperature cycling.

Shelf Life/Storage:

Shelf life for each component is one year when stored at 25°C in original, unopened container.

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Products Trade Name
CoolTherm EP-6037/6010 CoolTherm EP-6037/6010 Epoxy System

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